Person:
Wong,
C. P.
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Publication Search Results
Separation of Low Molecular Siloxanes for Electronic Application by Liquid-Liquid Extraction
Conductivity Mechanisms of Isotropic Conductive Adhesives (ICA’s)
Comparative Study of Thermally Conductive Fillers for Use in Liquid Encapsulants for Electronic Packaging
Use of Compliant Adhesives in the Large Area Processing of MCM-D Substrates
A Study of Lubricants on Silver Flakes for Microelectronics Conductive Adhesives
Novel Bi-Layer Conformal Coating for Reliability Without Hermeticity MEMS Encapsulation
Novel Thermally Reworkable Underfill Encapsulants For Flip-Chip Applications
Mechanisms Underlying the Unstable Contact Resistance of Conductive Adhesives
Recent Advances in Plastic Packaging of Flip-Chip and Multichip Modules (MCM) of Microelectronics
Correlation of Flip Chip Underfill Process Parameters and Material Properties with In-Process Stress Generation