Title:
Separation of Low Molecular Siloxanes for Electronic Application by Liquid-Liquid Extraction
Separation of Low Molecular Siloxanes for Electronic Application by Liquid-Liquid Extraction
Author(s)
Wong, C. P.
Urasaki, Naoyuki
Urasaki, Naoyuki
Advisor(s)
Editor(s)
Collections
Supplementary to
Permanent Link
Abstract
Silicone resins are widely used for electronic packaging
as potting and encapsulating materials. Silicone resins
have many advantages for electronic packaging applications such
as superior electrical properties, thermal stability, low water
absorption, etc. Furthermore, silicone resins are not only used as
protective materials for integrated circuit (IC) devices but also
as conducting materials for interconnection. However, silicone
resins have two big drawbacks: low adhesion strength and low
molecular weight creep. A simple liquid-liquid extraction method
has been developed to purify silicone resins, which will improve
adhesion strength and eliminate low molecular weight creep.
This paper describes the results of the liquid-liquid extraction
method to remove low molecular weight cyclic siloxanes. Fourier
transform-infrared (FT-IR) spectroscopy was used to monitor the
removal rate of low molecular weight cyclic siloxanes. Thermogravimetric
analysis (TGA) was used to evaluate the purity of
silicone resin. Gas chromatography-mass spectrometry (GC/MS)
was used to identify the low molecular weight cyclic siloxanes.
Thermomechanical analyzer (TMA), dynamic mechanical analyzer
(DMA), and die shear test were used for evaluate the
properties of silicone resin.
Sponsor
Date Issued
1999-10
Extent
55100 bytes
Resource Type
Text
Resource Subtype
Article