Title:
Recent Advances in Plastic Packaging of Flip-Chip and Multichip Modules (MCM) of Microelectronics
Recent Advances in Plastic Packaging of Flip-Chip and Multichip Modules (MCM) of Microelectronics
Author(s)
Wong, C. P.
Wong, Michelle M.
Wong, Michelle M.
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Abstract
The success in consumer electronics in the 1990’s will
be focused on low-cost and high performance electronics. Recent
advances in polymeric materials (plastics) and integrated circuit
(IC) encapsulants have made high-reliability very-large-scale integration
(VLSI) plastic packaging a reality. High-performance
polymeric materials possess excellent electrical and physical properties
for IC protection. With their intrinsic low modulus and
soft gel-like nature, silicone gels have become very effective
encapsulants for larger, high input/output (I/O) (in excess of
10 000), wire-bonded and flip-chip VLSI chips. Furthermore, the
recently developed silica-filled epoxies underfills, with the well controlled
thermal coefficient of expansion (TCE), have enhanced
the flip-chip and chip-on-board, direct chip attach (DCA) encapsulations.
Recent studies indicate that adequate IC chip surface
protection with high-performance silicone gels and epoxies plastic
packages could replace conventional ceramic hermetic packages.
This paper will review the IC technological trends, and IC
encapsulation materials and processes. Special focus will be
placed on the high-performance silicone and epoxy underfills,
their chemistries and use as VLSI device encapsulants for single
and multichip module applications.
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Date Issued
1999-03
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89822 bytes
Resource Type
Text
Resource Subtype
Article