Title:
Use of Compliant Adhesives in the Large Area Processing of MCM-D Substrates
Use of Compliant Adhesives in the Large Area Processing of MCM-D Substrates
Author(s)
Wong, C. P.
Wu, Jiali
Pike, Randy T.
Wu, Jiali
Pike, Randy T.
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Abstract
Large area substrate processing is a key solution
for improving the productivity of multichip module deposition
(MCM-D) technology. This project is focused on high temperature
polymeric adhesives for attachment of silicon tiles to suitable
pallets to facilitate large area film processing of MCM structures.
Current polymeric high temperature adhesives are predominately
polyimide-based that are not reworkable, which places an obstacle
to remove the coated substrates and to reuse the high
cost pallets. However, an approach will be presented in this
paper to address this demand by introducing thermally cleavable
links in the thermoset polyimide-amide resin. A series of novel
reworkable high temperature (in excess of 350–400 ℃) adhesives
have been developed, that can meet the requirements of adhesion,
viscosity, thermal stability, and reworkability of the MCM-D
production. Furthermore, scanning electron microscopy (SEM)
microstructure images are presented for intuitive reworkability
analysis.
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Date Issued
1998-10
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345691 bytes
Resource Type
Text
Resource Subtype
Article