Person:
Wong,
C. P.
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Publication Search Results
Improved Stability of Contact Resistance of Low Melting Point Alloy Incorporated Isotropically Conductive Adhesives
Evaluation and Characterization of Reliable Non-Hermetic Conformal Coatings for Microelectromechanical System (MEMS) Device Encapsulation
Use of Compliant Adhesives in the Large Area Processing of MCM-D Substrates
Development of High Performance Interfill Materials for System Chips Technology
Novel Bi-Layer Conformal Coating for Reliability Without Hermeticity MEMS Encapsulation
Development of New Low Stress Epoxies for MEMS Device Encapsulation
Correlation of Flip Chip Underfill Process Parameters and Material Properties with In-Process Stress Generation