Title:
Development of New Low Stress Epoxies for MEMS Device Encapsulation
Development of New Low Stress Epoxies for MEMS Device Encapsulation
Author(s)
Wong, C. P.
Wu, Jiali
Wu, Jiali
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Abstract
In this study, a series of new low stress epoxies was introduced
as conformal encapsulants, which show a high promise to
meet all the requirements for the protection of the pressure sensor
system. Mechanical properties such as initial Young’s modulus,
toughness and ultimate tensile stress were evaluated. The more
critical issue of material’s contamination resistance to the jet fuel
was improved. And the mechanism behind materials lowstress and
toughness behaviors was investigated from the viewpoint of microstructure.
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Date Issued
2002-06
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231705 bytes
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Article