Title:
Improved Stability of Contact Resistance of Low Melting Point Alloy Incorporated Isotropically Conductive Adhesives
Improved Stability of Contact Resistance of Low Melting Point Alloy Incorporated Isotropically Conductive Adhesives
Author(s)
Wong, C. P.
Moon, Kyoung-Sik
Wu, Jiali
Moon, Kyoung-Sik
Wu, Jiali
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Abstract
With the driving force of “green” revolution in
the electronics industry, tremendous efforts have been made in
pursuing lead-free alternatives. Although lately lead-free alloys
have drawn a lot of attention, their technical weaknesses, such
as high processing temperature, poor wetting and high surface
tension, limit their applications on the thermally sensitive, flexible,
nonsolderable substrates and the ultra-fine pitch size flip chip
interconnection. Conventional isotropically conductive adhesives
(ICAs) have been used widely in surface mount and die-attach
technologies for electrical interconnection and heat dissipation.
The low temperature processing of ICAs is one of the major advantages
over lead-free solders, which brings a low system stress,
simple manufacture process and the like. In order to enhance the
contact resistance of ICAs, the low melting point alloy (LMA)
incorporating technology has been developed by our group. In this
paper, LMA fusing methods were studied, since nonfused LMA
in ICAs after a curing process can adversely affect the physical
property and contact resistance stability. A differential scanning
calorimeter (DSC) was used for the basic examination of depleting
rate of LMAs in the typical ICAs. The cross-sectional morphology,
LMA distribution and intermetallic compound were investigated
by a scanning electron microscope (SEM). In addition, contact
resistance for the ICA formulation incorporated with LMAs
under elevated temperature and humidity was evaluated.
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Date Issued
2003-06
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