Organizational Unit:
School of Materials Science and Engineering
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Publication Search Results
Study and Characterization on the Nanocomposite Underfill for Flip Chip Applications
Modeling of the Curing Kinetics of No-Flow Underfill in Flip-Chip Applications
Double-Layer No-Flow Underfill Process for Flip-Chip Applications
Development of No-Flow Underfill Materials for Lead-Free Solder Bumped Flip-Chip Applications
Novel Reworkable Fluxing Underfill for Board-Level Assembly
FEM Modeling of Temperature Distribution of a Flip-Chip No-Flow Underfill Package During Solder Reflow Process
Assembly of Lead-free Bumped Flip-Chip with No-Flow Underfills
Recent Advances in Flip-Chip Underfill: Materials, Process, and Reliability
Double-Layer No-Flow Underfill Materials and Process
Development of Environmental Friendly Non-Anhydride No-Flow Underfills