Title:
Development of No-Flow Underfill Materials for Lead-Free Solder Bumped Flip-Chip Applications
Development of No-Flow Underfill Materials for Lead-Free Solder Bumped Flip-Chip Applications
Author(s)
Wong, C. P.
Zhang, Zhuqing
Shi, Songhua
Zhang, Zhuqing
Shi, Songhua
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Abstract
No-flow underfill process in flip-chip assembly
has become a promising technology toward a smaller, faster
and more cost-efficient packaging technology. The current
available no-flow underfill materials are mainly designed
for eutectic tin-lead (Sn/Pb) solders. With the advance of
lead-free interconnection due to the environmental concerns,
a new no-flow underfill chemistry needs to be developed for
lead-free solder bumped flip-chip applications. Many epoxy
resin/hexahydro-4-methyl phthalic anhydride (HMPA)/metal
acetylacetonate material systems have been screened in terms
of their curing behavior. Some potential base formulations
with curing peak temperatures higher than 200 ℃ (based on
differential scanning calorimetry at a heating rate of 5 ℃/min)
are selected for further study. The proper fluxing agents are
developed and the effects of fluxing agents on the curing
behavior and cured material properties of the potential base
formulations are studied using differential scanning calorimetry
(DSC), thermomechanical analyzer (TMA), dynamic-mechanical
analyzer (DMA), thermogravimetric analyzer (TGA),
and rheometer. Fluxing capability of the developed no-flow
formulations is evaluated using the wetting test of lead-free
solder balls on a copper board. The developed no-flow underfill
formulations show sufficient fluxing capability and good
potential for lead-free solder bumped flip-chip applications.
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Date Issued
2001-03
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167310 bytes
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Text
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Article