Title:
Recent Advances in Flip-Chip Underfill: Materials, Process, and Reliability
Recent Advances in Flip-Chip Underfill: Materials, Process, and Reliability
Author(s)
Wong, C. P.
Zhang, Zhuqing
Zhang, Zhuqing
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Abstract
In order to enhance the reliability of a flip-chip on organic
board package, underfill is usually used to redistribute the
thermomechanical stress created by the coefficient of thermal expansion
(CTE) mismatch between the silicon chip and organic substrate.
However, the conventional underfill relies on the capillary
flow of the underfill resin and has many disadvantages. In order to
overcome these disadvantages, many variations have been invented
to improve the flip-chip underfill process. This paper reviews the
recent advances in the material design, process development, and
reliability issues of flip-chip underfill, especially in no-flow underfill,
molded underfill, and wafer-level underfill. The relationship
between the materials, process, and reliability in these packages is
discussed.
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Date Issued
2004-08
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830600 bytes
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Text
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Article