Title:
Congestion and Power Integrity Aware Placement and Routing for 3D Packaging
Congestion and Power Integrity Aware Placement and Routing for 3D Packaging
Author(s)
Minz, Jacob Rajkumar
Choi, Jinwoo
Swaminathan, Madhavan
Lim, Sung Kyu
Choi, Jinwoo
Swaminathan, Madhavan
Lim, Sung Kyu
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Abstract
One of the major concerns for a 3-D package is to deal with power supply noise. Decoupling Capacitances (decap) allocation is a powerful technique to suppress power supply noise. In this work we integrate noise analysis and decap estimation in the floorplanning process. We also use the global routers results directly to estimate congestion and tight couple global routing with floorplanning to get a better area/congestion trade-off. Our experiments prove the quality of our approach. We obtain improvements in both decap amount and congestion with only small increase in area, wirelength and runtime.
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Date Issued
2004-04-23
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340096 bytes
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Text
Resource Subtype
Technical Report