Title:
Novel Nano-Scale Conductive Films With Enhanced Electrical Performance and Reliability for High Performance Fine Pitch Interconnect
Novel Nano-Scale Conductive Films With Enhanced Electrical Performance and Reliability for High Performance Fine Pitch Interconnect
Author(s)
Li, Yi
Yim, Myung Jin
Moon, Kyoung-Sik
Wong, C. P.
Yim, Myung Jin
Moon, Kyoung-Sik
Wong, C. P.
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Abstract
In this paper, a novel nano-scale conductive film which combines the advantages of both traditional anisotropic conductive adhesives/films (ACAs/ACFs) and nonconductive adhesives/films (NCAs/NCFs) is introduced for next generation high-performance ultra-fine pitch packaging applications. This novel interconnect film possesses the properties of electrical conduction along the z direction with relatively low bonding pressure (ACF-like) and the ultra-fine pitch (< 30 μm) capability (NCF-like). The nano-scale conductive film also allows a lower bonding pressure than NCF to achieve a much lower joint resistance (over two orders of magnitude lower than typical ACF joints) and higher current carrying capability. With low temperature sintering of nano-silver fillers, the joint resistance of the nano-scale conductive film was as low as 10―5 Ohm. The reliability of the nano-scale conductive film after high temperature and humidity test (85°C/85% RH) was also improved compared to the NCF joints. The insertion loss of nano-scale conductive film joints up to 10 GHz was almost the same as that of the standard ACF or NCF joints, suggesting that the nano-scale conductive film is suitable for reliable high-frequency adhesive joints in microelectronics packaging.
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Date Issued
2009-02
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Article