Novel Nano-Scale Conductive Films With Enhanced Electrical Performance and Reliability for High Performance Fine Pitch Interconnect

Li, Yi; Yim, Myung Jin; Moon, Kyoung-Sik; Wong, C. P.

Title:

Novel Nano-Scale Conductive Films With Enhanced Electrical Performance and Reliability for High Performance Fine Pitch Interconnect

dc.contributor.author	Li, Yi
dc.contributor.author	Yim, Myung Jin
dc.contributor.author	Moon, Kyoung-Sik
dc.contributor.author	Wong, C. P.
dc.contributor.corporatename	Georgia Institute of Technology. School of Materials Science and Engineering
dc.date.accessioned	2009-10-20T18:29:05Z
dc.date.available	2009-10-20T18:29:05Z
dc.date.issued	2009-02
dc.description	© 2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or distribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.	en
dc.description	DOI: 10.1109/TCAPT.2009.2012720
dc.description.abstract	In this paper, a novel nano-scale conductive film which combines the advantages of both traditional anisotropic conductive adhesives/films (ACAs/ACFs) and nonconductive adhesives/films (NCAs/NCFs) is introduced for next generation high-performance ultra-fine pitch packaging applications. This novel interconnect film possesses the properties of electrical conduction along the z direction with relatively low bonding pressure (ACF-like) and the ultra-fine pitch (< 30 μm) capability (NCF-like). The nano-scale conductive film also allows a lower bonding pressure than NCF to achieve a much lower joint resistance (over two orders of magnitude lower than typical ACF joints) and higher current carrying capability. With low temperature sintering of nano-silver fillers, the joint resistance of the nano-scale conductive film was as low as 10―5 Ohm. The reliability of the nano-scale conductive film after high temperature and humidity test (85°C/85% RH) was also improved compared to the NCF joints. The insertion loss of nano-scale conductive film joints up to 10 GHz was almost the same as that of the standard ACF or NCF joints, suggesting that the nano-scale conductive film is suitable for reliable high-frequency adhesive joints in microelectronics packaging.	en
dc.identifier.citation	Yi Li, Myung Jin Yim, Kyoung Sik Moon, and C. P. Wong, "Novel Nano-Scale Conductive Films With Enhanced Electrical Performance and Reliability for High Performance Fine Pitch Interconnect," IEEE Transactions on Advanced Packaging, Vol. 32, No. 1, February 2009 123-129	en
dc.identifier.issn	1521-3323
dc.identifier.uri	http://hdl.handle.net/1853/30603
dc.language.iso	en_US	en
dc.publisher	Georgia Institute of Technology	en
dc.publisher.original	Institute of Electrical and Electronics Engineers, Inc., New York
dc.subject	Bonding processes	en
dc.subject	Electrical conductivity	en
dc.subject	Integrated circuit interconnections	en
dc.subject	Integrated circuit packaging	en
dc.subject	Integrated circuit reliability	en
dc.subject	Nanotechnology	en
dc.subject	Sintering	en
dc.subject	Thin films	en
dc.title	Novel Nano-Scale Conductive Films With Enhanced Electrical Performance and Reliability for High Performance Fine Pitch Interconnect	en
dc.type	Text
dc.type.genre	Article
dspace.entity.type	Publication
local.contributor.author	Wong, C. P.
local.contributor.corporatename	School of Materials Science and Engineering
local.contributor.corporatename	College of Engineering
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