Title:
Reworkable high temperature adhesives for Multichip Module (MCM-D) and Chip-on-Board (COB) applications
Reworkable high temperature adhesives for Multichip Module (MCM-D) and Chip-on-Board (COB) applications
Author(s)
Pike, Randy T.
Advisor(s)
Wong, C. P.
Editor(s)
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Abstract
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Date Issued
1999-08
Extent
Resource Type
Text
Resource Subtype
Thesis
Rights Statement
Access restricted to authorized Georgia Tech users only.