Title:
Reworkable high temperature adhesives for Multichip Module (MCM-D) and Chip-on-Board (COB) applications
Reworkable high temperature adhesives for Multichip Module (MCM-D) and Chip-on-Board (COB) applications
Authors
Pike, Randy T.
Authors
Advisors
Wong, C. P.
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Person
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Abstract
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Date Issued
1999-08
Extent
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Text
Resource Subtype
Thesis
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Access restricted to authorized Georgia Tech users only.