Title:
Reworkable high temperature adhesives for Multichip Module (MCM-D) and Chip-on-Board (COB) applications
Reworkable high temperature adhesives for Multichip Module (MCM-D) and Chip-on-Board (COB) applications
dc.contributor.advisor | Wong, C. P. | |
dc.contributor.author | Pike, Randy T. | en_US |
dc.contributor.department | Materials Science and Engineering | en_US |
dc.date.accessioned | 2008-01-31T12:36:16Z | |
dc.date.available | 2008-01-31T12:36:16Z | |
dc.date.issued | 1999-08 | en_US |
dc.description.degree | M.S. | en_US |
dc.identifier.bibid | 496293 | en_US |
dc.identifier.uri | http://hdl.handle.net/1853/19506 | |
dc.publisher | Georgia Institute of Technology | en_US |
dc.rights | Access restricted to authorized Georgia Tech users only. | en_US |
dc.subject.lcsh | Multichip modules (Microelectronics) Testing | en_US |
dc.subject.lcsh | Microelectronics | en_US |
dc.subject.lcsh | Electronic packaging | en_US |
dc.subject.lcsh | Adhesives | en_US |
dc.subject.lcsh | Surface mount technology | en_US |
dc.title | Reworkable high temperature adhesives for Multichip Module (MCM-D) and Chip-on-Board (COB) applications | en_US |
dc.type | Text | |
dc.type.genre | Thesis | |
dspace.entity.type | Publication | |
local.contributor.advisor | Wong, C. P. | |
local.contributor.corporatename | School of Materials Science and Engineering | |
local.contributor.corporatename | College of Engineering | |
relation.isAdvisorOfPublication | 76540daf-1e96-4626-9ec1-bc8ed1f88e0a | |
relation.isOrgUnitOfPublication | 21b5a45b-0b8a-4b69-a36b-6556f8426a35 | |
relation.isOrgUnitOfPublication | 7c022d60-21d5-497c-b552-95e489a06569 |
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