Person:
Wong,
C. P.
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Publication Search Results
Separation of Low Molecular Siloxanes for Electronic Application by Liquid-Liquid Extraction
Conductivity Mechanisms of Isotropic Conductive Adhesives (ICA’s)
Comparative Study of Thermally Conductive Fillers for Use in Liquid Encapsulants for Electronic Packaging
A Study of Lubricants on Silver Flakes for Microelectronics Conductive Adhesives
Novel Bi-Layer Conformal Coating for Reliability Without Hermeticity MEMS Encapsulation
Novel Thermally Reworkable Underfill Encapsulants For Flip-Chip Applications
Mechanisms Underlying the Unstable Contact Resistance of Conductive Adhesives
Recent Advances in Plastic Packaging of Flip-Chip and Multichip Modules (MCM) of Microelectronics
Correlation of Flip Chip Underfill Process Parameters and Material Properties with In-Process Stress Generation