Person:
Wong,
C. P.
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Publication Search Results
Improved Stability of Contact Resistance of Low Melting Point Alloy Incorporated Isotropically Conductive Adhesives
Evaluation and Characterization of Reliable Non-Hermetic Conformal Coatings for Microelectromechanical System (MEMS) Device Encapsulation
Development of High Performance Interfill Materials for System Chips Technology
Development of New Low Stress Epoxies for MEMS Device Encapsulation