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Lim, Sung Kyu

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Author: Lim, Sung Kyu × Author: Minz, Jacob Rajkumar × End date: 2004 × Start date: 2004 × Type: Text × search.filters.applied.f.resourcesubtype: Technical Report ×

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Channel and Pin Assignment for Three Dimensional Packaging Routing

2004-05-24 , Minz, Jacob Rajkumar , Lim, Sung Kyu

Three dimensional packaging is becoming a popular concept because of the numerous advantages it has to offer over the existing conventional technologies. System on Packages (SOP) is an example of three dimensional packaging. The contribution of this work is threefold: (i) formulation of the new 3-dimensional global routing problem, (ii) a new routing flow that considers the various design constraints unique to SOP, and (iii) a global router for the technology. Our related experimental results demonstrate the effectiveness of our algorithm.

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Congestion and Power Integrity Aware Placement and Routing for 3D Packaging

2004-04-23 , Minz, Jacob Rajkumar , Choi, Jinwoo , Swaminathan, Madhavan , Lim, Sung Kyu

One of the major concerns for a 3-D package is to deal with power supply noise. Decoupling Capacitances (decap) allocation is a powerful technique to suppress power supply noise. In this work we integrate noise analysis and decap estimation in the floorplanning process. We also use the global routers results directly to estimate congestion and tight couple global routing with floorplanning to get a better area/congestion trade-off. Our experiments prove the quality of our approach. We obtain improvements in both decap amount and congestion with only small increase in area, wirelength and runtime.

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