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Institute for Electronics and Nanotechnology (IEN)

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Now showing 1 - 10 of 49
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Thermal Transport in 3D Carbon Nanostructures under Mechanical Deformation

2020-07-30 , Park, Jungkyu (Justin)

The rising of wearable devices and flexible electronics started to demand the development of materials which are mechanically flexible, lightweight, and electrically conductive. Considering that the structural materials in flexible electronics are subject to constant mechanical straining during daily use, the thermal management is expected to become an even more critical problem in flexible electronics since most of materials exhibit degraded thermal transport properties when a mechanical strain is imposed. Even exciting novel nanomaterials such as graphene and carbon nanotubes (CNTs) show significantly lowered thermal conductivities after being stretched. In this regards, 3D carbon nanostructures will open a new possibility for achieving efficient heat dissipation in flexible electronics because of their unique thermal behavior under strain. Unlike conventional materials, 3D carbon nanostructures that will be developed in this project will show an increase in thermal conductivity with an increase in tensile strain. The remarkable mechanical properties (i.e. Young’s modulus of 1 TPa and yield strengths of 100 GPa) of their base nanomaterials, i.e. CNTs and graphene make the 3D carbon nanostructures to be more attractive candidates for wearable electronics, and their porous architecture is expected to significantly reduce the structural weight of the devices. In this presentation, thermal transport properties of 3D carbon nanostructures under mechanical strain are explored. Moreover, their exciting applications in futuristic flexible electronics will be introduced.

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In-situ heating experiments in TEM/STEM

2020-06-25 , Tian, Mengkun

In-situ heating experiment performed in the scanning/ transmission electron microscopes (STEM/TEM) allows us to directly observe the dynamic behaviors of the materials with sizes ranging from micron- to atomic level in real time. The Materials Characterization Facilities (MCF) at IEN currently has two microscopes (FEI Tecnai F30 and Hitachi HD2700) with in-situ heating capabilities. The TEM techniques including (large-scale or atomic) imaging, phase/elemental analysis and diffraction that we could perform in those facilities for in-situ heating will be introduced briefly. A few examples made by the users and manufactures will be given to show how useful the in-situ heating experiments can help us to understand the structural evolution of materials fundamentally. Finally, it will be discussed a strategy to deal with preparation of TEM samples for high temperature heating.

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X-Ray Diffraction (XRD) for the Analysis of Thin Films

2020-06-04 , Tavakoli, David A.

XRD is a powerful technique to perform qualitative and quantitative analyses of materials and is most widely used for the identification of unknown crystalline materials. Determination of unknown solids is critical to studies in geology, environmental science, and material science to name but a few. When X-Rays contact a crystal, a series of reflections are produced that are unique and characteristic for each phase, similar to a fingerprint. It is a laboratory method that does not require large amounts of material, even very small amounts of material can be measured with special holders, and is non-destructive. Though often used as a technique to work with powders or bulk materials, this presentation will be focused on how thin films from nanometers to micrometers in thickness can be analyzed. Glancing Angle XRD is a technique to look at the chemistry and dislocation of thin films. Reflectivity is a technique that will allow us to measure the thickness of thin films, as well as its density and roughness.

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Photolithography at GT-IEN: An Overview of Processes and Equipment

2020-05-14 , Chen, Hang

Photolithography has always been the most important technique in microelectronics fabrication. It uses light to transfer a geometric pattern from a photomask (also called an optical mask) to a photosensitive (that is, light-sensitive) chemical photoresist on the substrate, or it can be directly written with a UV-laser equipment. It provides precise control of the shape and size of the objects it creates and can create patterns over an entire surface cost-effectively. The Georgia Tech Institute for Electronics and Nanotechnology (IEN) cleanroom provides various types of photolithography equipment to satisfy different processing needs. Each tool has its own unique characteristics and serves different purposes. In this seminar, a brief introduction to the equipment and patterning capabilities of the IEN will be presented. Common processing issues related to photolithography will also be discussed.

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Biomimetic Understanding to Fabrication of Artificial Basilar Membrane, Blood-Brain Barrier Microchip, and SAW devices

2020-07-23 , Banerjee, Sourav

Microelectromechanical systems (MEMS) are gradually transforming at the interface of biology for multiple novel applications in the future. Integrated Material Assessment and Predictive Simulation Laboratory (i-MAPS) at the University of South Carolina (UofSC) has significant thrust on acoustical biomimetic for various applications. The approach is primarily based on observation, modeling and fabrication. All applications are derived from natural acoustic processes that we tend to ignore but naturally developed in the mammalian body. Through observation of the mechanism, understanding of the physics is derived from modified optimized physics-based models. Upon confirmation, the systems are fabricated for testing and validation. a) Inspired by the human cochlea, which is a magnificent acoustic device, an artificial basilar membrane is fabricated for potential use as mechanical Fourier Transformer. The device has potential applications in artificial hearing aids and artificial hearing devices for efficient human-robot interactions in the future. b) Natural transport of medicine and molecules through blood-brain-barrier (BBB) is challenging, however, with the aid of acoustical perturbation it is found to have increased absorption. Through understanding the physical mechanism acoustically aided artificial BBB are researched with neural experiments in acoustically aided microfluidic system. c) The lab-on-a-chip devices are very effective in sensing different mechanical and physical parameters related to biosensing, irrespective of their field of application, but has noticeable limitations. The limitation comes mostly from the demands posed by the users in a simultaneous sensing and the actuation environment, employing mutually exclusive physics and mechanisms. To overcome such limitations, acoustic waves devices are proposed for both sensing and actuation in a single platform simultaneously. The physics of surface acoustic wave (SAW) is one valuable physics used in MEMS that gives SAW devices to cover a wide range of applications such as filters, oscillators, transformers, sensors and actuators for biosensing.

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Fundamentals of Photomask Design

2020-06-18 , Hollerbach, Benjamin (Ben) P.

The creation of a photomask set is the first step to producing any variety of semiconductor devices. Thinking through how each mask will be used and the processing steps around them will ensure a smoother process flow and greater device yield. A brief overview of the terminology, technology, techniques around photomask design & creation, and the tools needed to evaluate and fabricate a successful photomask set will be presented.

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Plasma Etching: An Overview of Equipment and Processing at IEN

2020-05-28 , Thomas, Mikkel A.

Etching is one of the fundamental building blocks of microelectronic fabrication. Removing material through chemical or physical means is an essential skill found in most microelectronics laboratories. The Institute for Electronics and Nanotechnology (IEN) at Georgia Tech offers a wide variety of tools and technologies to etch materials during a multitude of fabrication processes. Tools range from typical plasma enhanced etchers to vapor based etchers. With 15+ etch tools in the facility, IEN staff has the flexibility to configure each tool with a different selection of gases, which enables different etch capabilities and allow the IEN to segregate processes within the facility. In this seminar, a brief introduction to the tools and technologies available in the IEN cleanrooms will be presented. Common etching issues and concerns will also be discussed.

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Heat Transfer Across Length Scales – Focus on Thermal Management and Advanced Sensing

2020-07-09 , Moore, Arden

The rapid development of faster, cheaper, and more powerful computing has led to some of the most important technological and societal advances in modern history. However, the physical means associated with enhancing computing capabilities at the device and die levels have also created a very challenging set of circumstances for keeping electronic devices cool, a critical factor in determining their speed, efficiency, and reliability. With advances in nanoelectronics and the emergence of new application areas such as three-dimensional chip stack architectures and flexible electronics, now more than ever there are both needs and opportunities for novel materials and strategies to help address some of these pressing thermal management challenges. In this talk, our group’s work in the areas of new materials, advanced sensing, and developing a more robust understanding of thermal energy transport across length scales is presented, with emphasis on research areas which leverage industry-relevant materials science and microfabrication principles.

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Wire-bonding Overview and Packaging Toolsets at Georgia Tech IEN

2020-06-11 , White, Christopher P.

The shared user labs within the Institute for Electronics and Nanotechnology at Georgia Tech include an electronics packaging toolset. A brief overview of assembly and interconnection toolsets and technologies available within IEN will be presented. A process overview on wire-bonding capabilities will also be discussed.

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Laser Micromachining at GT-IEN

2020-05-21 , Shafer, Richard

The Institute of Electronics and Nanotechnology (IEN) Laser Micro-machining Laboratory has been in operation since 2014. The mission of the laser micro-machining laboratory is to provide the capability to laser machine parts to researchers from academic, industry and government agencies at an affordable rate. Come learn about what services the IEN micro-machining laboratory offers including, Nd:Ylf laser machining, deep ultraviolet (DUV) laser ablation, RF-excited CO2 laser machining and a new Femtosecond Laser Micromachining System . The lab houses laser cutting machines that operate at several wavelengths to allow machining on a broad spectrum of materials and also offers an Areosol Jet Printer that allows the printing of ink onto various substrates down to 10um line widths.

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