Design methodology for low power 3D-integrated image sensing system for network based applications

Lie, Denny

Title:

Design methodology for low power 3D-integrated image sensing system for network based applications

dc.contributor.advisor	Mukhopadhyay, Saibal
dc.contributor.author	Lie, Denny
dc.contributor.committeeMember	Yalamanchili, Sudhakar
dc.contributor.committeeMember	Raychowdhury, Arijit
dc.contributor.committeeMember	Lim, Sung Kyu
dc.contributor.committeeMember	Qiu, Peng
dc.contributor.department	Electrical and Computer Engineering
dc.date.accessioned	2016-05-27T13:09:44Z
dc.date.available	2016-05-27T13:09:44Z
dc.date.created	2015-05
dc.date.issued	2015-01-30
dc.date.submitted	May 2015
dc.date.updated	2016-05-27T13:09:44Z
dc.description.abstract	This dissertation investigates a methodology that can be used to design and optimize an energy efficient 3D-integrated image sensing and compression system for network based applications. A system level model that evaluates the effect of design choices and external environmental factors to the power/performance of the system is presented. Three design principles are considered in formulating the system model. First, a multi-segment/multi-core image compression approach is presented as a combined solution with 3D-stacking to reduce the workload of the compression module, effectively increasing power efficiency of the system. Second, vertical stacking reduces the rate of heat removal from the compression module and ADC resulting in higher temperature and noise in the photodiode tier. Therefore, due to the die-to-die thermal coupling, image quality is strongly influenced by image throughput, architectural, and external environment factors. Third, heterogeneous integration of the photosensor module and compression engine is presented as a method to increase power efficiency of the system. Scaling the compression engine to deep sub-micron technology provides substantial power and chip area benefits, while CMOS image sensor retains reliability with less advanced 180nm process. The dissertation concludes that 3D heterogeneous integration can increase power/performance efficiency of an image sensor system, but die-to-die thermal coupling may provide challenges in managing the quality of the compressed images.
dc.description.degree	Ph.D.
dc.format.mimetype	application/pdf
dc.identifier.uri	http://hdl.handle.net/1853/54862
dc.language.iso	en_US
dc.publisher	Georgia Institute of Technology
dc.subject	VLSI
dc.subject	Digital system
dc.subject	3D integration
dc.title	Design methodology for low power 3D-integrated image sensing system for network based applications
dc.type	Text
dc.type.genre	Dissertation
dspace.entity.type	Publication
local.contributor.advisor	Mukhopadhyay, Saibal
local.contributor.corporatename	School of Electrical and Computer Engineering
local.contributor.corporatename	College of Engineering
relation.isAdvisorOfPublication	62df0580-589a-4599-98af-88783123945a
relation.isOrgUnitOfPublication	5b7adef2-447c-4270-b9fc-846bd76f80f2
relation.isOrgUnitOfPublication	7c022d60-21d5-497c-b552-95e489a06569
thesis.degree.level	Doctoral