Title:
A Study of Contact Resistance of Conductive Adhesives Based on Anhydride-Cured Epoxy Systems
A Study of Contact Resistance of Conductive Adhesives Based on Anhydride-Cured Epoxy Systems
Author(s)
Wong, C. P.
Lu, Daoqiang
Lu, Daoqiang
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Abstract
Electrically conductive adhesives (ECAs) are an environmentally
friendly alternative to tin/lead (Sn/Pb) solders in electronics
packaging applications. However, current conductive technology
is still in its infancy and limitations do exist. One of the critical
reliability issues is that contact resistance of silver flake-filled
ECAs on nonnoble metals increases in elevated temperature and
humidity environments. The main objective of this study is to investigate
the contact resistance behaviors of a class of conductive adhesives,
which are based on anhydride-cured epoxy systems. Curing
profiles, moisture pickup, and shifts of contact resistance of the
ECAs on a nonnoble metal, tin/lead (Sn/Pb), during aging are investigated.
Also, two corrosion inhibitors are employed to stabilize
the contact resistance. The effects of these corrosion inhibitors
on contact resistance are compared. It is found that: 1) this class
of ECAs shows low moisture absorption, 2) the contact resistance
of the ECAs on Sn/Pb decreases first and then increases slowly
during 85 C/85% relative humidity (RH) aging, 3) one of corrosion
inhibitors is very effective to stabilize contact resistance of
these ECAs on Sn/Pb, and 4) the corrosion inhibitor stabilizes contact
resistance through adsorption on Sn/Pb surfaces. From this
study, it can be concluded that ECAs based on anhydride cured
epoxy systems are promising formulations for electronics packaging
applications.
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Date Issued
2000-09
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123348 bytes
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Text
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Article