Title:
Planar lightwave integrated circuits with embedded actives for board and substrate level optical signal distribution
Planar lightwave integrated circuits with embedded actives for board and substrate level optical signal distribution
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Author(s)
Jokerst, Nan Marie
Gaylord, Thomas K.
Glytsis, Elias N.
Brooke, Martin A.
Cho, S.
Nonaka, T.
Suzuki, T.
Geddis, Demetris L.
Shin, Jaemin
Villalaz, R.
Hall, J.
Chellapa, Ananthasayanam
Vrazel, M.
Gaylord, Thomas K.
Glytsis, Elias N.
Brooke, Martin A.
Cho, S.
Nonaka, T.
Suzuki, T.
Geddis, Demetris L.
Shin, Jaemin
Villalaz, R.
Hall, J.
Chellapa, Ananthasayanam
Vrazel, M.
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Abstract
As the data rate of integrated circuits dramatically
increases, interconnection speed at the backplane and board levels
are beginning to limit system performance, which drives investigations
into alternative interconnection technologies. Critical
factors to consider when evaluating alternative interconnection
approaches include interconnect speed, power consumption,
area, and compatibility with current backplane and board
integration technologies. Optical interconnections can achieve
very high speed with a significant reduction in interconnect
footprint compared to transmission lines, robust signal quality
in high-density interconnection systems because of immunity to
electromagnetic interference, and potentially simple to design
(compared to transmission lines) lines with materials which
can be postprocessed onto printed wiring boards or integrated
into the board structure. This paper explores design options for
planar optical interconnections integrated onto boards, discusses
fabrication options for both beam turning and embedded interconnections
to optoelectronic devices, describes integration
processes for creating embedded planar optical interconnections,
and discusses measurement results for a number of integration
schemes that have been demonstrated by the authors. In the area
of optical interconnections with beams coupled to and from the
board, the topics covered include integrated metal-coated polymer
mirrors and volume holographic gratings for optical beam turning
perpendicular to the board. Optical interconnections that utilize
active thin film (approximately 1-5 µm thick) optoelectronic
components embedded in the board are also discussed, using both
Si and high temperature FR-4 substrates. Both direct and evanescent
coupling of optical signals into and out of the waveguide are
discussed using embedded optical lasers and photodetectors.
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Date Issued
2004-05
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Article