High-Performance Chip-to-Chip Communications Using Advanced Materials and Structures

Kohl, Paul A.; Spencer, Todd; Osborn, Tyler

Title:

High-Performance Chip-to-Chip Communications Using Advanced Materials and Structures

dc.contributor.author	Kohl, Paul A.
dc.contributor.author	Spencer, Todd
dc.contributor.author	Osborn, Tyler
dc.contributor.corporatename	Georgia Institute of Technology. School of Chemical and Biomolecular Engineering
dc.date.accessioned	2008-09-29T12:29:32Z
dc.date.available	2008-09-29T12:29:32Z
dc.date.issued	2008-09-09
dc.description	Paul A. Kohl, Todd Spencer and Tyler Osborn from the School of Chemical and Biomolecular Engineering presented a lecture at the Nano@Tech Meeting on September 9, 2008 at 12 noon in room 102 of the MiRC building.	en
dc.description	Runtime: 61:09 minutes
dc.description.abstract	The "off-chip" bandwidth is a major bottleneck causing system delays and limited throughput, especially in areas such as processor-to-memory bandwidth and processor-to-network. The ITRS cites off-chip signal bandwidth exceeding 60 GHz within 10 years. Organic substrates (i.e. chip packages or interposers) with flip-chip solder connections are the core of the first and second level of interconnect. Off-chip bandwidth is limited to several GHz due to frequency dependent attenuation, signal reflections, and crosstalk within the polymer dielectric, via structures, and I/O signal path transitions within the chip substrate and mother board. In this work, we have introduced advances in off-chip interconnect using air-isolated, coaxial links on substrates and boards to demonstrate ultra high-speed chip-to-chip and chip-to-network communications. New approaches have been found to fabricating high frequency I/O, air-and isolated coaxial links on the substrate. The materials, processes and electrical characteristics will be presented.
dc.format.extent	61:09 minutes
dc.identifier.uri	http://hdl.handle.net/1853/25011
dc.language.iso	en_US	en
dc.publisher	Georgia Institute of Technology	en
dc.relation.ispartofseries	Nano@Tech Lecture Series
dc.subject	Nanotechnology	en
dc.subject	Interconnect	en
dc.subject	Microelectronics	en
dc.subject	Off-chip bandwidth
dc.title	High-Performance Chip-to-Chip Communications Using Advanced Materials and Structures	en
dc.title.alternative	Integrated Circuits:The Problem with Wires (and Some Solutions)	en
dc.type	Moving Image
dc.type	Text
dc.type.genre	Lecture
dc.type.genre	Presentation
dspace.entity.type	Publication
local.contributor.author	Kohl, Paul A.
local.contributor.corporatename	Institute for Electronics and Nanotechnology (IEN)
local.relation.ispartofseries	Nano@Tech Lecture Series
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relation.isOrgUnitOfPublication	5d316582-08fe-42e1-82e3-9f3b79dd6dae
relation.isSeriesOfPublication	accfbba8-246e-4389-8087-f838de8956cf