Title:
System implementation, modeling and defects pattern recognition for flip chip solder joint inspection using laser techniques
System implementation, modeling and defects pattern recognition for flip chip solder joint inspection using laser techniques
| dc.contributor.advisor | Ume, I. Charles | |
| dc.contributor.author | Liu, Sheng | en_US |
| dc.contributor.department | Mechanical engineering | en_US |
| dc.date.accessioned | 2007-07-27T11:32:51Z | |
| dc.date.available | 2007-07-27T11:32:51Z | |
| dc.date.issued | 2001-05 | en_US |
| dc.description.degree | Ph.D. | en_US |
| dc.identifier.bibid | 608215 | en_US |
| dc.identifier.uri | http://hdl.handle.net/1853/15833 | |
| dc.publisher | Georgia Institute of Technology | en_US |
| dc.rights | Access restricted to authorized Georgia Tech users only. | en_US |
| dc.subject.lcsh | Electronic packaging | en_US |
| dc.subject.lcsh | Solder and soldering | en_US |
| dc.subject.lcsh | Lasers in engineering | en_US |
| dc.title | System implementation, modeling and defects pattern recognition for flip chip solder joint inspection using laser techniques | en_US |
| dc.type | Text | |
| dc.type.genre | Dissertation | |
| dspace.entity.type | Publication | |
| local.contributor.corporatename | George W. Woodruff School of Mechanical Engineering | |
| local.contributor.corporatename | College of Engineering | |
| relation.isOrgUnitOfPublication | c01ff908-c25f-439b-bf10-a074ed886bb7 | |
| relation.isOrgUnitOfPublication | 7c022d60-21d5-497c-b552-95e489a06569 |
Files
Original bundle
1 - 1 of 1
No Thumbnail Available
- Name:
- liu_sheng_200105_phd_608215.pdf
- Size:
- 15.86 MB
- Format:
- Adobe Portable Document Format
- Description: