Title:
System implementation, modeling and defects pattern recognition for flip chip solder joint inspection using laser techniques
System implementation, modeling and defects pattern recognition for flip chip solder joint inspection using laser techniques
Author(s)
Liu, Sheng
Advisor(s)
Ume, I. Charles
Editor(s)
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Abstract
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Date Issued
2001-05
Extent
Resource Type
Text
Resource Subtype
Dissertation
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Access restricted to authorized Georgia Tech users only.