Title:
Metrology of gan electronics using micro-raman spectroscopy

dc.contributor.advisor Graham, Samuel
dc.contributor.author Beechem, Thomas E., III en_US
dc.contributor.committeeMember Bassiri-Gharb, Nazanin
dc.contributor.committeeMember Doolittle, William A.
dc.contributor.committeeMember Garimella, Srinivas
dc.contributor.committeeMember Green, Dan
dc.contributor.committeeMember Sitaraman, Suresh
dc.contributor.department Mechanical Engineering en_US
dc.date.accessioned 2009-01-22T15:44:36Z
dc.date.available 2009-01-22T15:44:36Z
dc.date.issued 2008-11-17 en_US
dc.description.abstract Possessing a wide band gap and large break down field, gallium nitride (GaN) is of interest for a host of high power, high frequency applications including next generation cellular base stations, advanced military radar, and WiMAX networks. Much of this interest stems from the continued development of the AlGaN/GaN high electron mobility transistor (HEMT) that is capable of operating at sizable power densities and switching speeds. The same fields responsible for this performance, however, also elicit acute device heating and elastic loads. These induced thermomechanical loads limit both performance and reliability thus necessitating continued improvement in the management and characterization of the coupled environments. In response, this study establishes a new implementation of Raman spectroscopy capable of simultaneously measuring the operational temperature and stress in a HEMT using only the Stokes response. First, the linewidth (FWHM) of the Stokes signal is utilized to quantify the operating temperature of a HEMT independent to the influences of stress. Second, a new method, incorporating the use of the linewidth and peak position in tandem, is developed to estimate the biaxial thermoelastic stress that arises during device operation. With this capability, the HEMT's resultant load is assessed, highlighting the large role of the residual stress on the total mechanical state of the device. Subsequently, this same linewidth is leveraged to identify the distinct effect that electrical carriers have on the thermally relevant decay of longitudinal optical phonon modes. Further investigation of the lattice transport then concludes the study by way of an analytical treatment describing the significant influence of interfacial disorder on the energy transport at GaN/substrate boundaries. en_US
dc.description.degree Ph.D. en_US
dc.identifier.uri http://hdl.handle.net/1853/26544
dc.publisher Georgia Institute of Technology en_US
dc.subject Phonon lifetime en_US
dc.subject GaN en_US
dc.subject Stress en_US
dc.subject Raman spectroscopy en_US
dc.subject Temperature en_US
dc.subject.lcsh Gallium nitride
dc.subject.lcsh Metrology
dc.subject.lcsh Modulation-doped field-effect transistors
dc.subject.lcsh Raman spectroscopy
dc.title Metrology of gan electronics using micro-raman spectroscopy en_US
dc.type Text
dc.type.genre Dissertation
dspace.entity.type Publication
local.contributor.advisor Graham, Samuel
local.contributor.corporatename George W. Woodruff School of Mechanical Engineering
local.contributor.corporatename College of Engineering
relation.isAdvisorOfPublication cf62405d-2133-40a8-b046-bce4a3443381
relation.isOrgUnitOfPublication c01ff908-c25f-439b-bf10-a074ed886bb7
relation.isOrgUnitOfPublication 7c022d60-21d5-497c-b552-95e489a06569
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