Title:
Biomedical implant packaging

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dc.contributor.author Tummala, Rao R. en_US
dc.contributor.author Sundaram, Venkatesh en_US
dc.contributor.corporatename Georgia Institute of Technology. Office of Sponsored Programs en_US
dc.contributor.corporatename Georgia Institute of Technology. School of Electrical and Computer Engineering en_US
dc.contributor.corporatename Georgia Institute of Technology. Office of Sponsored Programs
dc.date.accessioned 2012-06-08T19:11:06Z
dc.date.available 2012-06-08T19:11:06Z
dc.date.issued 2011-05-31 en_US
dc.description Issued as final report en_US
dc.description.sponsorship Texas Instruments Incorporated en_US
dc.identifier.other 10741 en_US
dc.identifier.uri http://hdl.handle.net/1853/43829
dc.publisher Georgia Institute of Technology en_US
dc.relation.ispartofseries School of Electrical and Computer Engineering ; Project no. 111413 en_US
dc.title Biomedical implant packaging en_US
dc.title.alternative Advanced package integration to miniaturize medical implants en_US
dc.type Text
dc.type.genre Technical Report
dspace.entity.type Publication
local.contributor.author Tummala, Rao R.
local.contributor.corporatename School of Electrical and Computer Engineering
local.contributor.corporatename College of Engineering
local.contributor.corporatename Office of Sponsored Programs
local.relation.ispartofseries OSP Final Research Reports
relation.isAuthorOfPublication fe05ddb2-e957-4584-ac88-58a197df62aa
relation.isOrgUnitOfPublication 5b7adef2-447c-4270-b9fc-846bd76f80f2
relation.isOrgUnitOfPublication 7c022d60-21d5-497c-b552-95e489a06569
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