Title:
Study on adhesion of underfill materials for flip chip packaging
Study on adhesion of underfill materials for flip chip packaging
Author(s)
Luo, Shijian
Advisor(s)
Wong, C. P.
Editor(s)
Collections
Supplementary to
Permanent Link
Abstract
Sponsor
Date Issued
2002-05
Extent
236 bytes
Resource Type
Text
Resource Subtype
Dissertation
Rights Statement
Access restricted to authorized Georgia Tech users only.