Title:
In Situ Acoustic Temperature Measurement During Variable-Frequency Microwave Curing
In Situ Acoustic Temperature Measurement During Variable-Frequency Microwave Curing
| dc.contributor.author | Davis, Cleon E. | en_US |
| dc.contributor.author | Dickherber, Anthony | en_US |
| dc.contributor.author | Hunt, William D. | en_US |
| dc.contributor.author | May, Gary S. | en_US |
| dc.contributor.corporatename | Georgia Institute of Technology. Center for Organic Photonics and Electronics | en_US |
| dc.date.accessioned | 2013-06-27T19:45:02Z | |
| dc.date.available | 2013-06-27T19:45:02Z | |
| dc.date.issued | 2008-10 | |
| dc.description | © 2008 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. | en_US |
| dc.description.abstract | Variable-frequency microwave (VFM) curing can perform the same processing steps as conventional thermal processing in minutes, without compromising intrinsic material properties. With increasing demand for novel dielectrics, there is a corresponding demand for new processing techniques that lead to comparable or better properties than conventional methods. VFM processing can be a viable alternative to conventional thermal techniques. However, current limitations include a lack of reliable temperature measuring techniques. This research focuses on developing a reliable temperature measuring system using acoustic techniques to monitor low-k polymer dielectrics cured on silicon wafers in a VFM furnace. The acoustic sensor exhibits the capability to measure temperatures from 20 degrees C to 300 degrees C with an attainable accuracy of ± 2 degrees. | en_US |
| dc.identifier.citation | Davis, Cleon E. and Dickherber, Anthony and Hunt, William D. and May, Gary S., "In Situ Acoustic Temperature Measurement During Variable-Frequency Microwave Curing," IEEE Transactions on Electronics Packaging Manufacturing, Vol. 31, no.4, pp.273-284 (October 2008). | en_US |
| dc.identifier.doi | 10.1109/TEPM.2008.2004570 | en_US |
| dc.identifier.issn | 1521-334X (print) | |
| dc.identifier.uri | http://hdl.handle.net/1853/48102 | |
| dc.language.iso | en_US | en_US |
| dc.publisher | Georgia Institute of Technology | en_US |
| dc.publisher.original | Institute of Electrical and Electronics Engineers | en_US |
| dc.subject | Acoustic temperature sensing | en_US |
| dc.subject | polymer curing | en_US |
| dc.subject | rapid curing | en_US |
| dc.subject | variable frequency microwave curing | en_US |
| dc.subject | zinc oxide deposition | en_US |
| dc.title | In Situ Acoustic Temperature Measurement During Variable-Frequency Microwave Curing | en_US |
| dc.type | Text | |
| dc.type.genre | Article | |
| dspace.entity.type | Publication | |
| local.contributor.author | Hunt, William D. | |
| local.contributor.corporatename | Center for Organic Photonics and Electronics | |
| relation.isAuthorOfPublication | 8dfe8c09-39f6-4895-9ac7-547efb52a173 | |
| relation.isOrgUnitOfPublication | 43f8dc5f-0678-4f07-b44a-edbf587c338f |
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