Title:
In Situ Acoustic Temperature Measurement During Variable-Frequency Microwave Curing
In Situ Acoustic Temperature Measurement During Variable-Frequency Microwave Curing
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Author(s)
Davis, Cleon E.
Dickherber, Anthony
Hunt, William D.
May, Gary S.
Dickherber, Anthony
Hunt, William D.
May, Gary S.
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Abstract
Variable-frequency microwave (VFM) curing can perform the same processing steps as conventional thermal processing in minutes, without compromising intrinsic material properties. With increasing demand for novel dielectrics, there is a corresponding demand for new processing techniques that lead to comparable or better properties than conventional methods. VFM processing can be a viable alternative to conventional thermal techniques. However, current limitations include a lack of reliable temperature measuring techniques. This research focuses on developing a reliable temperature measuring system using acoustic techniques to monitor low-k polymer dielectrics cured on silicon wafers in a VFM furnace. The acoustic sensor exhibits the capability to measure temperatures from 20 degrees C to 300 degrees C with an attainable accuracy of ± 2 degrees.
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2008-10
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Article