Title:
Analysis of the effects of wafer slicing on the mechanical integrity of silicon wafers
Analysis of the effects of wafer slicing on the mechanical integrity of silicon wafers
Authors
Melkote, Shreyes N.
Danyluk, Steven
Wu, Hao
Danyluk, Steven
Wu, Hao
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North Carolina State University
Date Issued
2011-12-31
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Resource Subtype
Technical Report