Title:
Analysis of the effects of wafer slicing on the mechanical integrity of silicon wafers

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116481_2010-GIT-4_Final_Report_v2.pdf (4.02 MB)
Authors
Melkote, Shreyes N.
 Danyluk, Steven
 Wu, Hao
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http://hdl.handle.net/1853/47883
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North Carolina State University
Date Issued
2011-12-31
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Technical Report
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