Title:
Analysis of the effects of wafer slicing on the mechanical integrity of silicon wafers
Analysis of the effects of wafer slicing on the mechanical integrity of silicon wafers
Author(s)
Melkote, Shreyes N.
Danyluk, Steven
Wu, Hao
Danyluk, Steven
Wu, Hao
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Sponsor
North Carolina State University
Date Issued
2011-12-31
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Text
Resource Subtype
Technical Report