Title:
Boron Diffusion In Silicon Devices

dc.contributor.patentcreator Rohatgi, Ajeet
dc.contributor.patentcreator Kim, Dong Seop
dc.contributor.patentcreator Nakayashiki, Kenta
dc.contributor.patentcreator Rounsaville, Brian
dc.date.accessioned 2017-05-12T14:28:50Z
dc.date.available 2017-05-12T14:28:50Z
dc.date.filed 12/13/2005
dc.date.issued 9/7/2010
dc.description.abstract Disclosed are various embodiments that include a process, an arrangement, and an apparatus for boron diffusion in a wafer. In one representative embodiment, a process is provided in which a boric oxide solution is applied to a surface of the wafer. Thereafter, the wafer is subjected to a fast heat ramp-up associated with a first heating cycle that results in a release of an amount of boron for diffusion into the wafer.
dc.description.assignee Georgia Tech Research Corporation
dc.identifier.cpc H01L31/1804
dc.identifier.cpc H01L21/2255
dc.identifier.cpc Y02E10/547
dc.identifier.patentapplicationnumber 11/301527
dc.identifier.patentnumber 7790574
dc.identifier.uri http://hdl.handle.net/1853/57878
dc.identifier.uspc 438/460
dc.title Boron Diffusion In Silicon Devices
dc.type Text
dc.type.genre Patent
dspace.entity.type Publication
local.contributor.corporatename Georgia Institute of Technology
local.relation.ispartofseries Georgia Tech Patents
relation.isOrgUnitOfPublication cc30e153-7a64-4ae2-9b1d-5436686785e3
relation.isSeriesOfPublication 0f49c79d-4efb-4bd9-b060-5c7f9191b9da
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