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Tummala, Rao R.

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Author: Kong, Linghua × search.filters.applied.f.isOrgUnitOfPublicationTitle: Center for Organic Photonics and Electronics ×

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Proximity Lithography in Sub-10 Micron Circuitry for Packaging Substrate

2010-11 , Wang, Fengtao , Liu, Fuhan , Kong, Linghua , Sundaram, Venky , Tummala, Rao R. , Adibi, Ali

Rapid changes in the semiconductor industry will continue toward higher functionality that leads to higher input/outputs (I/O) counts, pushing packaging towards higher density architectures. In the next two to three years, the I/O pitch will fall within 100 μm for area array die and 30 μm for periphery die. That raises an important question to the packaging industry: How will the rapid shrinkage of the I/O pitch affect the package substrate for chip attaching? The answer is sub-10 micron copper line technology. Theoretical and experimental studies on the limitations of using mercury i-line ultraviolet photolithography have been carried at the Packaging Research Center at Georgia Tech. Furthermore, ultra fine copper line routing substrates are demonstrated for flip chip attaching by using semi-additive metallization process.

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Single sensor that outputs narrowband multispectral images

2010-01 , Kong, Linghua , Yi, Dingrong , Sprigle, Stephen , Wang, Fengtao , Wang, Chao , Liu, Fuhan , Adibi, Ali , Tummala, Rao R.

We report the work of developing a hand-held (or miniaturized), low-cost, stand-alone, real-time-operation, narrow bandwidth multispectral imaging device for the detection of early stage pressure ulcers.

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