Person:
Wong,
C. P.
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Publication Search Results
Synthesis of High-Quality Vertically Aligned Carbon Nanotubes on Bulk Copper Substrate for Thermal Management
Near Void-Free Assembly Development of Flip Chip Using No-Flow Underfill
Recent Advances in High-k Nanocomposite Materials for Embedded Capacitor Applications
Investigation of electrical contact resistance for nonconductive film functionalized with Π -conjugated self-assembled molecules
Effect of Permittivity and Permeability of a Flexible Magnetic Composite Material on the Performance and Miniaturization Capability of Planar Antennas for RFID and Wearable Wireless Applications
Novel Nano-Scale Conductive Films With Enhanced Electrical Performance and Reliability for High Performance Fine Pitch Interconnect
Void Formation Study of Flip Chip in Package Using No-Flow Underfill
Enhanced Electrical Properties of Anisotropic Conductive Adhesive With $pi$ -Conjugated Self-Assembled Molecular Wire Junctions
Conformal Magnetic Composite RFID for Wearable RF and Bio-Monitoring Applications
A Novel Nanocomposite with Photo-Polymerization for Wafer Level Application
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