Person:
Wong,
C. P.
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Publication Search Results
Moisture Absorption in Uncured Underfill Materials
Study on Effect of Coupling Agents on Underfill Material in Flip Chip Packaging
Surface Property of Passivation Layer on Integrated Circuit Chip and Solder Mask Layer on Printed Circuit Board
Effect of UV/Ozone Treatment on Surface Tension and Adhesion in Electronic Packaging
Thermal and Mechanical Characterization of ViaLux™ 81: A Novel Epoxy Photo-Dielectric Dry Film (PDDF) for Microvia Applications
Study on Effect of Carbon Black on Behavior of Conductive Polymer Composites with Positive Temperature Coefficient