Title:
Moisture Absorption in Uncured Underfill Materials
Moisture Absorption in Uncured Underfill Materials
Author(s)
Wong, C. P.
Luo, Shijian
Luo, Shijian
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Abstract
This paper presents a systematic study on moisture
absorption in uncured underfill based on epoxy cured with acid
anhydride [methylhexahydrophthalic anhydride (MHHPA)] and
epoxy cured with non-acid anhydride curing agent. The influence
of absorbed moisture on curing properties, thermomechanical
property, and adhesion property of underfill after curing has
been investigated. For epoxy cured with non-acid anhydride, the
moisture absorption is low, and the absorbed moisture has no
significant effect on the properties of cured underfill materials.
For epoxy cured with acid anhydride, the moisture absorption
before curing can be more than 2.0%, and the absorbed moisture
can affect the properties significantly. The absorbed moisture
can catalyze the curing reaction between acid anhydride and
epoxy. The glass transition temperature of the cured samples is
reduced after the underfill absorbs the moisture before curing.
The adhesion strength decreases dramatically after the underfill
absorbs the moisture before curing.
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Date Issued
2004-06
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Article