Person:
Wong,
C. P.
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Publication Search Results
Adhesion Evaluation on Low-Cost Alternatives to Thermosetting Epoxy Encapsulants
Development of Reworkable Underfill From Hybrid Composite of Free Radical Polymerization System and Epoxy Resin
Study on Underfill/Solder Adhesion in Flip-Chip Encapsulation
Development of Environmental Friendly Non-Anhydride No-Flow Underfills