Title:
Adhesion Evaluation on Low-Cost Alternatives to Thermosetting Epoxy Encapsulants
Adhesion Evaluation on Low-Cost Alternatives to Thermosetting Epoxy Encapsulants
Author(s)
Wong, C. P.
Fan, Lianhua
Fan, Lianhua
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Abstract
The thermosetting epoxy curing systems have been
widely used as encapsulants in the electronic packaging industry.
With the continual evolving of electronic product markets, material
suppliers have been challenged to provide more options to meet
the requirements of advanced, yet cost effective, packaging solutions.
In this paper, two low-cost alternative materials have been investigated
experimentally regarding their adhesion and reliability
performance, and these have then been compared with the thermosetting
epoxy systems. One of the materials is thermoplastic
bisphenol A epoxy/phenoxy resin, and the other is an interpenetrating
polymer network composed of an epoxy curing component
and a free radical polymerizable component. Some formulations of
the materials being studied could exhibit excellent adhesion, durability
and application reliability. While reworkability is expected
for these materials, they are promising as cost effective encapsulants
for electronic packaging, and may be applied with appropriate
processing techniques.
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Date Issued
2003-04
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Article