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Naeemi, Azad

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    Performance Modeling, Design, and Benchmarking for Beyond-CMOS Devices and Circuits
    (Georgia Institute of Technology, 2017-11-28) Naeemi, Azad
    A diverse set of novel materials, physical phenomena, interconnects, logic and memory devices, and circuit/system concepts are being studied globally to sustain the exponential growth of the computational power of integrated circuits. As such, the search for beyond-CMOS devices and circuits must deal with all the levels of abstraction and must take a holistic approach to evaluate the potential performance of each possible option. In this talk, I will first present physical models for electronic and spintronic transport properties of various conventional and emerging materials such as graphene, Si and Cu. Then I will present compact physical models (SPICE models) for various physical phenomena such as nanomagnet dynamics, spin-orbit coupling and spin waves. The utilization of these models for device modeling will then be discussed and I will show how these models can be used to model the behavior of some of the proposed beyond-CMOS devices and to evaluate their potential performance once they are used in various representative Boolean and neuromorphic circuits. Through several examples, I will show how this process can be used to identify the main limiting factors for each device and to revise and refine them.
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    Carbon-Based Interconnects for Nanoelectronic Systems
    (Georgia Institute of Technology, 2009-04-07) Naeemi, Azad
    Interconnects have long been considered a major limitation for integrated circuits because of the delay they add to critical paths, the power they dissipate, the noise and jitter they induce on one another, and their vulnerability to electromigration. These problems are all exacerbated as interconnect dimensions scale to the dimensions comparable or even smaller than the mean free path of electrons in bulk copper. Carbon nanotubes and graphene nanoribbons are being investigated as potential solutions to the challenges facing nanoscale interconnects because of their extremely large capacity for electrical and thermal conduction. Most of the fascinating properties of carbon nanomaterials can be attributed to their one dimensional nature, the exceptionally strong carbon bonds, and the peculiar bandstructure of graphene. In this talk, physical models are presented for carbon nanotube and graphene nanoribbon interconnects. These models are then used to benchmark them against conventional copper interconnects. The results offer important guidelines for technology development of these novel interconnects.