Organizational Unit:
George W. Woodruff School of Mechanical Engineering
George W. Woodruff School of Mechanical Engineering
Permanent Link
Research Organization Registry ID
Description
Previous Names
Parent Organization
Parent Organization
Organizational Unit
Includes Organization(s)
Organizational Unit
Organizational Unit
Organizational Unit
Organizational Unit
Organizational Unit
ArchiveSpace Name Record
195 results
Publication Search Results
Now showing
1 - 10 of 195
-
ItemForced internal convection mist cooling heat transfer(Georgia Institute of Technology, 2013-09-26) Sadowski, Dennis L.This report describes work completed and results achieved on the” Forced Internal Convection Mist Cooling Heat Transfer” project from its inception on November 4, 2002 through its conclusion on August 31, 2013. This work involved close collaboration between the Georgia Institute of Technology (GT), the Schoonover Consulting Group (SCG), and the Naval Research Laboratory (NRL). The primary goal of the project was to design, develop, and test a system to adequately cool the Hibachi foils in the Electra KrF laser at the Naval Research Laboratory in Washington, DC. Though it took several iterations, we did successfully devise a system which met the goal of keeping the foils cool with minimal disruption to the focal profile or efficiency of the laser. By withdrawing a relatively small amount of KrF gas from the laser and redirecting it towards the Hibachi foils in the form of hundreds of tiny high velocity near-wall jets the foils showed a dramatic decrease in temperature. Focal profile measurements of the laser beam were far better than that achieved by any other cooling system. It is unfortunate that Congressional funding cuts scuttled the Electra program before we were able to complete full-scale, long-term testing with gas recirculation.
-
ItemDevelopment of compliant free-standing structures for sub 32-nm multi-core ICs(Georgia Institute of Technology, 2012-11) Sitaraman, Suresh K. ; Swaminathan, MadhavanWith the introduction of on-chip low-K dielectric materials, it is increasingly important to reduce on-chip stresses so that the low-K dielectric material will not crack or delaminate. One way to reduce the thermo-mechanical stresses is to introduce compliant structures between the die and the substrate and thus to decouple the die from the substrate. Decoupling the die from the substrate or the substrate from the board by means of mechanically compliant interconnects will reduce stresses created by the coefficient of thermal expansion mismatch. A decoupled diesubstrate or substrate-board interface will allow the different components to expand or contract differently without inducing high stresses in the components. In this work, we report the design, fabrication, modeling, and characterization of innovative multi-path fan-shaped off-chip compliant interconnects. The proposed interconnects can be fabricated at the wafer-level and are cost-effective, can be of fine pitch and scalable, and will have redundant electrical paths.
-
ItemAnalysis of the effects of wafer slicing on the mechanical integrity of silicon wafers(Georgia Institute of Technology, 2011-12-31) Melkote, Shreyes N. ; Danyluk, Steven ; Wu, Hao
-
ItemNIRT: Electron beam chemical vapor deposition (CVD) - a new tool for manufacturing nanomaterials and devices(Georgia Institute of Technology, 2011-09-22) Lackey, W. Jack ; Wang, Zhong ; Fedorov, Andrei G. ; Orlando, Thomas M.
-
ItemGeorgia Tech radiological engineering course development(Georgia Institute of Technology, 2011-08-09) Hertel, Nolan E. ; Kahn, Bernd ; Rosson, Robert L. ; Utschig, Tris
-
ItemInvestigation of environmental effects on the fatigue degradation properties in metallic nanostructures(Georgia Institute of Technology, 2011-08) Pierron, Olivier N. ; Baumert, EvaThe research activities of this EAGER grant focused on the development of an experimental technique dedicated to measuring the fatigue properties of nanomaterials, specifically nanocrystalline metallic nanobeams. This MEMS-based nanotensile testing setup can be used to measure the fatigue properties of nanocrystalline nanobeams (fatigue life, cyclic stress-strain curves, transient behavior). Fatigue tests can be performed for a wide range of maximum applied stresses and strains, frequencies (up to ~0.25-1Hz with the thermal-actuator-based MEMS devices), and environment. While the fatigue test presented in this report was performed in laboratory air, future tests can be performed in an environmental chamber to assess the influence of temperature and humidity on the fatigue properties. Last but not least, the same experimental setup can be used to perform quantitative in-situ TEM tests, using an electrical biasing TEM holder.
-
ItemDEN fatigue testing(Georgia Institute of Technology, 2011-05-02) McDowell, David L.
-
ItemGeorgia Tech collaboration on DIII-D(Georgia Institute of Technology, 2011-03-30) Stacey, Weston M.
-
ItemAn advanced integrated diffusion/transport method for the design, analysis and optimization of the very-high-temperature reactors(Georgia Institute of Technology, 2010-12-31) Rahnema, Farzad ; Zhang, Dingkang ; Ougouag, Abderrafi ; Frederick, Gleicher
-
ItemArra: focal adhesions in cell adhesion strengthening(Georgia Institute of Technology, 2010-11-30) García, Andrés J.