Modeling, design and fabrication of substrate-embedded inductors with high inductance density and low DC resistance for integrated voltage regulators

Suresh, Srinidhi

Title:

Modeling, design and fabrication of substrate-embedded inductors with high inductance density and low DC resistance for integrated voltage regulators

dc.contributor.advisor	Tummala, Rao R.
dc.contributor.advisor	Swaminathan, Madhavan
dc.contributor.author	Suresh, Srinidhi
dc.contributor.committeeMember	Garmestani, Hamid
dc.contributor.department	Materials Science and Engineering
dc.date.accessioned	2020-05-20T17:01:55Z
dc.date.available	2020-05-20T17:01:55Z
dc.date.created	2020-05
dc.date.issued	2020-04-28
dc.date.submitted	May 2020
dc.date.updated	2020-05-20T17:01:55Z
dc.description.abstract	There is an increasing need for voltage regulators to be integrated closer to active devices such as CPUs and GPUs. These integrated voltage regulators (IVRs) provide numerous performance benefits including higher efficiency, lower parasitics, and increased functionality while miniaturizing the overall system size. However, passive components i.e. inductors, generally occupy the largest volume in power distribution networks (PDNs). Therefore, realizing high-density inductors with ultra-thin form-factors is the main bottleneck to enable highly miniaturized heterogeneous integration of IVRs. An approach that can design cores and topologies with ultra-high inductance density without increasing the real-estate by using low-cost integration processes is required to address the challenges of developing inductors for IVRs. Metal-polymer composites (MPCs)-based interleaved substrate-embedded toroid inductors can meet all the criteria. MPCs as cores for inductor packages have high permeability, high resistivity, low eddy current losses and high frequency stability. An embedded interleaved toroid inductor topology using MPC cores can provide 50% more inductance, 33% higher Q-factor for the same DC resistance compared to an embedded solenoid topology. The combination of better material properties of MPCs, with an efficient toroid topology provides very high inductance densities at smaller inductor sizes, while maintaining low losses and DC resistance. The proposed work aims to improve upon current material approaches for inductor fabrication by providing better density, reduced thickness and DC resistance in a package-integrated format. This work aims to provide a basic understanding of the performance of a single-inductor using embedded toroid approach and the properties that govern its electrical behavior which can be further be scaled to coupled/tapped inductors in next-generation systems.
dc.description.degree	M.S.
dc.format.mimetype	application/pdf
dc.identifier.uri	http://hdl.handle.net/1853/62819
dc.language.iso	en_US
dc.publisher	Georgia Institute of Technology
dc.subject	Integrated voltage regulator
dc.subject	Inductor
dc.subject	Metal polymer composite
dc.subject	Toroid inductor
dc.subject	48V-1V
dc.subject	Inductance density
dc.subject	DC resistance
dc.subject	Fabrication process
dc.title	Modeling, design and fabrication of substrate-embedded inductors with high inductance density and low DC resistance for integrated voltage regulators
dc.type	Text
dc.type.genre	Thesis
dspace.entity.type	Publication
local.contributor.advisor	Tummala, Rao R.
local.contributor.advisor	Swaminathan, Madhavan
local.contributor.corporatename	School of Materials Science and Engineering
local.contributor.corporatename	College of Engineering
relation.isAdvisorOfPublication	fe05ddb2-e957-4584-ac88-58a197df62aa
relation.isAdvisorOfPublication	974f4642-b132-43e2-9ca6-c40e8af82f93
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relation.isOrgUnitOfPublication	7c022d60-21d5-497c-b552-95e489a06569
thesis.degree.level	Masters