Title:
Thermal stress and fatigue life prediction for a VSPA package
Thermal stress and fatigue life prediction for a VSPA package
| dc.contributor.author | Sitarman, Suresh K. | |
| dc.contributor.corporatename | Georgia Institute of Technology. Office of Sponsored Programs | en_US |
| dc.contributor.corporatename | Georgia Institute of Technology. School of Mechanical Engineering | en_US |
| dc.date.accessioned | 2016-06-15T16:29:26Z | |
| dc.date.available | 2016-06-15T16:29:26Z | |
| dc.date.issued | 1996-09 | |
| dc.description | Issued as Quarterly report, and Reports [nos. 1-2], Project E-25-T75 | en_US |
| dc.embargo.terms | null | en_US |
| dc.identifier | t-25-t75 | |
| dc.identifier.uri | http://hdl.handle.net/1853/55203 | |
| dc.language.iso | en_US | en_US |
| dc.publisher | Georgia Institute of Technology | en_US |
| dc.relation.ispartofseries | School of Mechanical Engineering ; Project no. E-25-T75 | en_US |
| dc.subject.lcsh | Solder and soldering Testing | |
| dc.subject.lcsh | Electronic packaging Testing | |
| dc.title | Thermal stress and fatigue life prediction for a VSPA package | en_US |
| dc.type | Text | |
| dc.type.genre | Technical Report | |
| dspace.entity.type | Publication |