Process Compensated Micromechanical Resonators

dc.contributor.patentcreator Ho, Gavin Kar-fai
dc.contributor.patentcreator Ayazi, Farrokh
dc.date.accessioned 2017-05-12T14:28:41Z
dc.date.available 2017-05-12T14:28:41Z
dc.date.filed 12/11/2007
dc.date.issued 7/21/2009
dc.description.abstract Disclosed are micromechanical tapered I-shaped bulk acoustic resonators. An exemplary resonator is formed on a substrate, which is preferably silicon. The resonator has a central rod (or extensional member) coupled to two tapered lateral flanges (or flexural members). The central extensional member and tapered flexural members are separated from the substrate. One or more electrodes are disposed adjacent to the tapered flexural members, are separated therefrom by small gaps, and are separated from the substrate. One or more anchors are coupled to the substrate, are laterally separated from the central rod by small gaps, and are coupled to the central rod by supports. The one or more anchors support and suspend the central rod and flexural members from the substrate. Process compensation is achieved using the tapered flexural members.
dc.description.assignee Georgia Tech Research Corp.
dc.identifier.cpc H03H3/0076
dc.identifier.cpc H03H3/0077
dc.identifier.cpc H03H9/2463
dc.identifier.patentapplicationnumber 12/001341
dc.identifier.patentnumber 7564162
dc.identifier.uri http://hdl.handle.net/1853/57811
dc.identifier.uspc 310/309
dc.title Process Compensated Micromechanical Resonators
dc.type Text
dc.type.genre Patent
dspace.entity.type Publication
local.contributor.corporatename Georgia Institute of Technology
local.relation.ispartofseries Georgia Tech Patents
relation.isOrgUnitOfPublication cc30e153-7a64-4ae2-9b1d-5436686785e3
relation.isSeriesOfPublication 0f49c79d-4efb-4bd9-b060-5c7f9191b9da
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