Title:
Method And Apparatus For Measuring Thermal Warpage

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dc.contributor.patentcreator Ume, Ifeanyi C.
dc.date.accessioned 2017-05-12T14:27:17Z
dc.date.available 2017-05-12T14:27:17Z
dc.date.filed 6/14/1994
dc.date.issued 2/11/1997
dc.description.abstract A method and apparatus for measuring thermally induced warpage in test elements such as printed wiring boards and printed wiring assemblies, including a heating chamber having a transparent window and support structure for supporting a printing wiring board in an observation orientation and position parallel to the transparent window. A glass grating placed adjacent the window and a light source shines through the window onto the printed wiring board under test. A camera is positioned for capturing images of shadow moire fringes formed over time as the oven heats up the printed wiring board or printed wiring assembly to simulate actual process conditions. A computer is used for controlling operation of the apparatus and for evaluating the captured images of the moire fringes in relation to the temperature as a function of time.
dc.description.assignee Georgia Tech Research Corporation
dc.identifier.cpc G01B11/167
dc.identifier.cpc G01N3/60
dc.identifier.patentapplicationnumber 08/259434
dc.identifier.patentnumber 5601364
dc.identifier.uri http://hdl.handle.net/1853/57233
dc.identifier.uspc 374/57
dc.title Method And Apparatus For Measuring Thermal Warpage
dc.type Text
dc.type.genre Patent
dspace.entity.type Publication
local.contributor.corporatename Georgia Institute of Technology
local.relation.ispartofseries Georgia Tech Patents
relation.isOrgUnitOfPublication cc30e153-7a64-4ae2-9b1d-5436686785e3
relation.isSeriesOfPublication 0f49c79d-4efb-4bd9-b060-5c7f9191b9da
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