Title:
Layer Assignment for System on Packages

dc.contributor.author Minz, Jacob Rajkumar
dc.contributor.author Lim, Sung Kyu
dc.date.accessioned 2005-03-23T16:06:45Z
dc.date.available 2005-03-23T16:06:45Z
dc.date.issued 2003
dc.description.abstract The routing environment for the new emerging mixed-signal System-on-Package (SOP) technology is more advanced than that of the conventional PCB or MCM technology - pins are located at all layers of SOP packaging substrate rather than the top-most layer only. We propose a new interconnect-centric layer assignment algorithm named LA-SOP that handles arbitrary routing topologies and produces near optimal results. The contribution of this work is threefold: (i) modeling of the SOP routing resource, (ii) formulation of the new SOP layer assignment problem, and (iii) development of a fast and novel algorithm that considers the various design constraints unique to SOP. We review various approaches for the PCB, IC and MCM algorithms and investigate their applicability to the SOP model. Our related experimental results demonstrate the effectiveness of our algorithm LA-SOP. en
dc.format.extent 185762 bytes
dc.format.mimetype application/pdf
dc.identifier.uri http://hdl.handle.net/1853/5930
dc.language.iso en_US
dc.publisher Georgia Institute of Technology en
dc.relation.ispartofseries CERCS;GIT-CERCS-03-12
dc.subject Algorithms en
dc.subject Layer assignment algorithm en
dc.subject Interconnects
dc.subject LA-SOP
dc.subject Layers
dc.subject Packaging
dc.subject Packaging substrates
dc.subject Pins
dc.subject Routing
dc.subject System-on-Package (SOP)
dc.title Layer Assignment for System on Packages en
dc.type Text
dc.type.genre Technical Report
dspace.entity.type Publication
local.contributor.author Lim, Sung Kyu
local.contributor.corporatename Center for Experimental Research in Computer Systems
local.relation.ispartofseries CERCS Technical Report Series
relation.isAuthorOfPublication 31bc3e86-9942-4b3f-aeae-783bb95052ff
relation.isOrgUnitOfPublication 1dd858c0-be27-47fd-873d-208407cf0794
relation.isSeriesOfPublication bc21f6b3-4b86-4b92-8b66-d65d59e12c54
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