Title:
Characterization and Design of Liquid Crystal Polymer (LCP) Based Multilayer RF Components and Packages

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dc.contributor.advisor Papapolymerou, John
dc.contributor.advisor Tentzeris, Emmanouil M.
dc.contributor.author Thompson, Dane C. en_US
dc.contributor.committeeMember Anew Peterson
dc.contributor.committeeMember Dennis Hess
dc.contributor.committeeMember Laskar, Joy
dc.contributor.committeeMember Mark Allen
dc.contributor.department Electrical and Computer Engineering en_US
dc.date.accessioned 2006-06-09T18:13:24Z
dc.date.available 2006-06-09T18:13:24Z
dc.date.issued 2006-04-11 en_US
dc.description.abstract This thesis discusses the investigation and utilization of a new promising thin-film material, liquid crystal polymer (LCP), for microwave and millimeter-wave (mm-wave [>30 GHz]) components and packages. The contribution of this research is in the determination of LCP's electrical and mechanical properties as they pertain to use in radio frequency (RF) systems up to mm-wave frequencies, and in evaluating LCP as a low-cost substrate and packaging material alternative to the hermetic materials traditionally desired for microwave circuits at frequencies above a few gigahertz (GHz). A study of LCP's mm-wave material properties was performed. Resonant circuit structures were designed to find the dielectric constant and loss tangent from 2-110 GHz under both ambient and elevated temperature conditions. Several unique processes were developed for the realization of novel multilayer LCP-based RF circuits. These processes include thermocompression bonding with tight temperature control (within a few degrees Celsius), precise multilayer alignment and patterning, and LCP laser processing with three different types of lasers. A proof-of-concept design that resulted from this research was a dual-frequency dual-polarization antenna array operating at 14 and 35 GHz. Device characterization such as mechanical flexibility testing of antennas and seal testing of packages were also performed. A low-loss interconnect was developed for laser-machined system-level thin-film LCP packages. These packages were designed for and measured with both RF micro-electromechanical (MEM) switches and monolithic microwave integrated circuits (MMICs). These research findings have shown LCP to be a material with uniquely attractive properties/capabilities for vertically integrated, compact multilayer LCP circuits and modules. en_US
dc.description.degree Ph.D. en_US
dc.format.extent 4736472 bytes
dc.format.mimetype application/pdf
dc.identifier.uri http://hdl.handle.net/1853/10498
dc.language.iso en_US
dc.publisher Georgia Institute of Technology en_US
dc.subject Dielectric characterization en_US
dc.subject Millimeter wave packaging
dc.subject Multilayer RF modules
dc.subject MMIC packaging
dc.subject Laser micromachining
dc.subject Liquid crystal polymer
dc.subject.lcsh Polymers Electric properties en_US
dc.subject.lcsh Radio frequency integrated circuits Design and construction en_US
dc.subject.lcsh Dielectric measurements en_US
dc.subject.lcsh Liquid crystals Mechanical properties en_US
dc.subject.lcsh Microwave circuits Design and construction en_US
dc.subject.lcsh Millimeter wave devices Design and construction en_US
dc.title Characterization and Design of Liquid Crystal Polymer (LCP) Based Multilayer RF Components and Packages en_US
dc.type Text
dc.type.genre Dissertation
dspace.entity.type Publication
local.contributor.advisor Tentzeris, Emmanouil M.
local.contributor.corporatename School of Electrical and Computer Engineering
local.contributor.corporatename College of Engineering
relation.isAdvisorOfPublication 763bf38d-e5cc-4ebb-b84a-74133d98e550
relation.isOrgUnitOfPublication 5b7adef2-447c-4270-b9fc-846bd76f80f2
relation.isOrgUnitOfPublication 7c022d60-21d5-497c-b552-95e489a06569
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