Title:
Investigation of electrical contact resistance for nonconductive film functionalized with Π -conjugated self-assembled molecules
Investigation of electrical contact resistance for nonconductive film functionalized with Π -conjugated self-assembled molecules
| dc.contributor.author | Dong, Hai | |
| dc.contributor.author | Li, Yi | |
| dc.contributor.author | Yim, Myung Jin | |
| dc.contributor.author | Moon, Kyoung-Sik | |
| dc.contributor.author | Wong, C. P. | |
| dc.contributor.corporatename | Georgia Institute of Technology. School of Materials Science and Engineering | |
| dc.date.accessioned | 2009-04-29T20:15:55Z | |
| dc.date.available | 2009-04-29T20:15:55Z | |
| dc.date.issued | 2007-02-26 | |
| dc.description | ©2007 American Institute of Physics. The electronic version of this article is the complete one and can be found online at: http://link.aip.org/link/?APPLAB/90/092102/1 | en |
| dc.description | DOI:10.1063/1.2709638 | |
| dc.description.abstract | Nonconductive adhesive/nonconductive film (NCA/NCF) bonding technology has attracted increasing research interests as lead-free interconnect. During bonding, heat and pressure are applied and the direct physical contacts between the two surfaces of integrated circuit bump and substrate bond pad can be achieved. The electrical contact resistance of a NCA/NCF joint is controlled by the pressure, roughness and NCA/NCF material properties. An accurate prediction of contact resistance can help guide experiment setup towards improving the electrical performance of NCA/NCF. In this study, a model is developed and correlated to experiments. The effects of NCA/NCF material properties on electrical contact resistance are investigated. | en |
| dc.identifier.citation | Applied Physics Letters, 90 (2007) 92102 | en |
| dc.identifier.issn | 0003-6951 | |
| dc.identifier.uri | http://hdl.handle.net/1853/27853 | |
| dc.language.iso | en_US | en |
| dc.publisher | Georgia Institute of Technology | en |
| dc.publisher.original | American Institute of Physics | |
| dc.subject | Electrical contacts | en |
| dc.subject | Contact resistance | en |
| dc.subject | Adhesives | en |
| dc.subject | Thin film circuits | en |
| dc.subject | Heat treatment | en |
| dc.subject | Surface roughness | en |
| dc.subject | Integrated circuit bonding | en |
| dc.subject | Integrated circuit interconnections | en |
| dc.subject | Integrated circuit modeling | en |
| dc.title | Investigation of electrical contact resistance for nonconductive film functionalized with Π -conjugated self-assembled molecules | en |
| dc.type | Text | |
| dc.type.genre | Article | |
| dspace.entity.type | Publication | |
| local.contributor.author | Wong, C. P. | |
| local.contributor.corporatename | School of Materials Science and Engineering | |
| local.contributor.corporatename | College of Engineering | |
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| relation.isOrgUnitOfPublication | 21b5a45b-0b8a-4b69-a36b-6556f8426a35 | |
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