Magnetically actuated peel test for thin film interfacial fracture and fatigue characterization

dc.contributor.advisor Sitaraman, Suresh K.
dc.contributor.author Ostrowicki, Gregory Thomas en_US
dc.contributor.committeeMember Hesketh, Peter
dc.contributor.committeeMember Kohl, Paul
dc.contributor.committeeMember Neu, Richard
dc.contributor.committeeMember Tummala, Rao
dc.contributor.department Mechanical Engineering en_US
dc.date.accessioned 2013-01-17T21:51:28Z
dc.date.available 2013-01-17T21:51:28Z
dc.date.issued 2012-11-07 en_US
dc.description.abstract Delamination along thin film interfaces is a prevalent failure mechanism in microelectronic, photonic, MEMS, and other engineering applications. Current interfacial fracture test techniques specific to thin films are limited by either sophisticated mechanical fixturing, physical contact near the crack tip, non-representative test specimens, or complicated stress fields. Moreover, these techniques are generally not suitable for investigating fatigue crack propagation under cyclical loading. A fixtureless and noncontact experimental test technique is thus proposed and implemented to study interfacial fracture for thin film systems. The proposed test incorporates permanent magnets surface mounted onto micro-fabricated released thin film structures. An applied external magnetic field induces noncontact monotonic or fatigue loading to initiate delamination along the interface between the thin film and underlying substrate. Characterization of the film deflection, peel angle, and delamination propagation is accomplished through in situ optical techniques. Analytical and finite-element models are used to extract fracture parameters from the experimental data using thin-film peel mechanics. The developed interfacial fracture test has been demonstrated for Cu thin films on a SiO₂/Si substrate. en_US
dc.description.degree PhD en_US
dc.identifier.uri http://hdl.handle.net/1853/45870
dc.publisher Georgia Institute of Technology en_US
dc.subject Magnetic acuation en_US
dc.subject Fatigue en_US
dc.subject Delamination en_US
dc.subject Peel test en_US
dc.subject Thin film en_US
dc.subject Fracture en_US
dc.subject.lcsh Thin films
dc.subject.lcsh Thin films Magnetic properties
dc.subject.lcsh Microelectromechanical systems
dc.subject.lcsh Microelectronics
dc.title Magnetically actuated peel test for thin film interfacial fracture and fatigue characterization en_US
dc.type Text
dc.type.genre Dissertation
dspace.entity.type Publication
local.contributor.advisor Sitaraman, Suresh K.
local.contributor.corporatename George W. Woodruff School of Mechanical Engineering
local.contributor.corporatename College of Engineering
relation.isAdvisorOfPublication 86701d63-9ca5-4060-89f8-aca6e0b267f6
relation.isOrgUnitOfPublication c01ff908-c25f-439b-bf10-a074ed886bb7
relation.isOrgUnitOfPublication 7c022d60-21d5-497c-b552-95e489a06569
Original bundle
Now showing 1 - 1 of 1
Thumbnail Image
5.46 MB
Adobe Portable Document Format