Title:
Probe Module For Testing Chips With Electrical And Optical Input/output Interconnects, Methods Of Use, And Methods Of Fabrication
Probe Module For Testing Chips With Electrical And Optical Input/output Interconnects, Methods Of Use, And Methods Of Fabrication
| dc.contributor.patentcreator | Thacker, Hiren D. | |
| dc.contributor.patentcreator | Ogunsola, Oluwafemi O. | |
| dc.contributor.patentcreator | Meindl, James D. | |
| dc.date.accessioned | 2017-05-12T14:28:29Z | |
| dc.date.available | 2017-05-12T14:28:29Z | |
| dc.date.filed | 8/31/2005 | |
| dc.date.issued | 3/25/2008 | |
| dc.description.abstract | Probe modules, methods of use of probe modules, and methods of preparing probe modules, are disclosed. A representative embodiment of a probe module, among others, includes a redistribution substrate and a probe substrate interfaced with the redistribution substrate. The probe substrate is operative to test at least one signal of at least one optoelectronic device under test. The probe substrate is operative to interface with electrical and optical components. | |
| dc.description.assignee | Georgia Tech Research Corporation | |
| dc.identifier.cpc | G01R31/311 | |
| dc.identifier.cpc | G02B6/12 | |
| dc.identifier.cpc | G02B6/12004 | |
| dc.identifier.patentapplicationnumber | 11/216645 | |
| dc.identifier.patentnumber | 7348786 | |
| dc.identifier.uri | http://hdl.handle.net/1853/57730 | |
| dc.identifier.uspc | 324/755.07 | |
| dc.title | Probe Module For Testing Chips With Electrical And Optical Input/output Interconnects, Methods Of Use, And Methods Of Fabrication | |
| dc.type | Text | |
| dc.type.genre | Patent | |
| dspace.entity.type | Publication | |
| local.contributor.corporatename | Georgia Institute of Technology | |
| local.relation.ispartofseries | Georgia Tech Patents | |
| relation.isOrgUnitOfPublication | cc30e153-7a64-4ae2-9b1d-5436686785e3 | |
| relation.isSeriesOfPublication | 0f49c79d-4efb-4bd9-b060-5c7f9191b9da |
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