Title:
Micro-mechanical sensor for the spectral decomposition of acoustic signals

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dc.contributor.advisor Allen, Mark G.
dc.contributor.author Kranz, Michael S. en_US
dc.contributor.committeeMember Brand, Oliver
dc.contributor.committeeMember Michaels, Jennifer
dc.contributor.committeeMember Michaels, Thomas
dc.contributor.committeeMember Ready, Jud W.
dc.contributor.department Electrical and Computer Engineering en_US
dc.date.accessioned 2011-07-06T16:25:04Z
dc.date.available 2011-07-06T16:25:04Z
dc.date.issued 2011-01-21 en_US
dc.description.abstract An array of electret-biased frequency-selective resonant microelectromechanical system (MEMS) acoustic sensors was proposed to perform analysis of stress pulses created during an impact between two materials. This analysis allowed classification of the stiffness of the materials involved in the impact without applying post-impact signal processing. Arrays of resonant MEMS sensors provided filtering of the incident stress pulse and subsequent binning of time-domain waveforms into frequency-based spectra. Results indicated that different impact conditions and materials yielded different spectral characteristics. These characteristics, as well as the resulting sensor array responses, are discussed and applied to impact classification. Each individual sensor element in the array was biased by an in situ charged electret film. A microplasma discharge apparatus embedded within the microsensor allowed charging of the electret film after all device fabrication was complete. This enabled electret film integration using high-temperature surface micromachining processes that would typically lead to discharge of traditionally formed electret materials. This also eliminated the traditional wafer-bonding and post-fabrication assembly processes required in conventional electret integration approaches. The microplasma discharge process and resulting electret performance are discussed within the context of the MEMS acoustic sensor array. en_US
dc.description.degree Ph.D. en_US
dc.identifier.uri http://hdl.handle.net/1853/39496
dc.publisher Georgia Institute of Technology en_US
dc.subject Microcorona en_US
dc.subject Strain sensor en_US
dc.subject MEMS en_US
dc.subject Ultrasonic en_US
dc.subject Microplasma en_US
dc.subject Electret en_US
dc.subject.lcsh Microelectromechanical systems
dc.subject.lcsh Spectrum analysis
dc.subject.lcsh Electrets
dc.subject.lcsh Ultrasonics
dc.title Micro-mechanical sensor for the spectral decomposition of acoustic signals en_US
dc.type Text
dc.type.genre Dissertation
dspace.entity.type Publication
local.contributor.corporatename School of Electrical and Computer Engineering
local.contributor.corporatename College of Engineering
relation.isOrgUnitOfPublication 5b7adef2-447c-4270-b9fc-846bd76f80f2
relation.isOrgUnitOfPublication 7c022d60-21d5-497c-b552-95e489a06569
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